Developed as an all-round thermal paste with the best possible price-performance ratio, the thermal pastes of the EC360® CARBON series are the ideal thermal compound for gaming PCs and industrial cooling systems. They offer ultimate stability and a high thermal conductivity of 5.15 W/mK. A good consistency makes it easy to apply and spread. At the same time, safe application is ensured as the thermal paste is not electrically conductive. A low bleeding constant and good evaporation properties make it durable and ensure that it does not dry out. Installation Recommendation: Clean surfaces from dirt and other possible residue. If applicable, isopropyl 90% alcohol is recommended to ensure a clean surface. Apply the product, for example by applying a drop in the center of the chip. Install the heatsink. Ideally the drop should have spread now, covering the entire chip in a thin layer of thermal paste without any air bubbles. If the result is not satisfactory apply again in a different quantity until the desired result has been achieved.