Heatsinks of the EC360® COPPER series are made from copper one of the materials with the best thermal conductivity. Designed as a premium passive cooling solution, they are suitable for intermediate users with high requirements. EC360® COPPER VGA-RAM heatsinks are passive heatsinks, especially for VGA-RAM memory chips, as well as other components like voltage regulators. The availability of a sophisticated cooling solution enables operation at maximum performance and extends the lifetime of sensitive components. The heatsinks are available in different sizes. They come with a sheet of double-sided EC360® TAPE STRONG thermal adhesive. A highly conductive thermal adhesive is essential for a good thermal transfer to the heatsink. As the heatsink is attached without screws, the installation is particularly easy and quick.